Executive Director
NextFlex
Dr. Daniel Gamota is the Executive Director of NextFlex. Prior to NextFlex, Dr. Gamota has more than 25 years in innovation, engineering, and manufacturing while leading major companies in the fields of microelectronics, advanced packaging, complex integrated systems, and hybrid electronics. Most recently, Dr. Gamota was VP and GM at Jabil where his global teams provided innovation & engineering services as well as scalable manufacturing operations to SMMs and Fortune 250 companies. He was previously with Motorola, where he served as director and fellow of the technical staff collaborating across the semiconductor, packaging, components, and manufacturing business units to commercialize automotive, communications, industrial, and government & public safety products.
He is well-known for heading R&D and collaborative innovation teams. In addition, Dr. Gamota has led several multi-member microelectronics systems solutions development programs (DARPA, NIST ATP, etc.). He is a member of the SEMI Board of Industry Leaders, University of Michigan MSE External Advisory Board, and San Jose State University Engineering Industry Advisory Council. Dr. Gamota is also active in and has chaired committees developing microelectronics, advanced packaging, and hybrid electronics guidelines, standards, and roadmaps for IEEE, iNEMI, GEA/IPC, IEC, A*STAR, and SEMI. Dr. Gamota was elevated to a NextFlex Fellow, IEEE Fellow, and was named a Dan Noble Fellow at Motorola for his contributions and leadership. He holds a Ph.D. from the University of Michigan and an MBA from Northwestern University.
