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SUMMARY:Webinar - New Frontiers in Semiconductor Standardization: Closing Gaps in Packaging\, Security\, and Supply Chain Resilience
DESCRIPTION:Semiconductors and microelectronics power nearly every critical and emerging technology from AI and quantum systems to advanced communications\, defense\, transportation\, and next-generation manufacturing. As the ecosystem shifts toward advanced packaging\, chiplet-based architectures\, heterogeneous integration\, specialized materials\, and increasingly complex global supply chains\, standards are essential to interoperability\, reliability\, security\, sustainability\, and determining national competitiveness on a global scale. \nThis webinar brings together expert panelists to examine the most consequential findings from ASCET’s Standardization Environmental Scan: Semiconductors & Microelectronics. The discussion will identify where standards are enabling progress\, where critical gaps remain\, and how shared testbeds\, metrology frameworks\, reference architectures\, supply-chain traceability\, and collaborative R&D can move emerging technologies from research and development toward standards readiness.
URL:https://ascet.com/event/webinar-new-frontiers-in-semiconductor-standardization-closing-gaps-in-packaging-security-and-supply-chain-resilience/
CATEGORIES:Semiconductors & Microelectronics
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